What is KIC profiler?

KIC is a technology company working to make reflow ovens smarter through thermal profiling, automation and optimization solutions.

How is PWI calculated?

The PWI for a complete set of profile statistics is calculated as the worst case (highest number) in the set of statistics. For example: if you run a profile with three thermocouples and four profile statistics are logged for each thermocouple, then there will be a set of 12 statistics for that profile.

What is PWI in reflow profile?

In manufacturing industry, PWI values are used to calibrate the heating and cooling of soldering jobs (known as a thermal profile) while baked in a reflow oven. PWI measures how well a process fits into a user-defined process limit known as the specification limit.

What is KIC?

A Knowledge and Innovation Community (KIC), is a highly autonomous partnership of leading higher education institutions, research organisations, companies and other stakeholders in the innovation process that tackles societal challenges through the development of products, services and processes and by nurturing …

What does a reflow oven do?

A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs).

What is reflow profile?

Reflow zone: The reflow zone, also referred to as the “time above liquidus” (TAL), is the part of the process where the highest temperature is reached. A common peak temperature is 20–40 °C above liquidus. Cooling zone: In the cooling zone, the temperature is gradually decreasing and makes solid solder joints.

What is KIC in fracture mechanics?

KIc is defined as the plane strain fracture toughness. It is a measure of the resistance of a material to crack extension under predominantly linear-elastic conditions (i.e. low toughness conditions when there is little to no plastic deformation occurring at the crack tip).

Is KIC a material property?

The fracture toughness test is performed to determine the value of the critical stress-intensity value, or plane-strain fracture toughness, KIC. This material property is used in the design of structural members made of high-strength materials.

At what temp does solder reflow?

The typical reflow temperature range for Pb-Free (Sn/Ag) solder is 240-250°C with 40-80 seconds over 220°C. It should be noted that the recommended Sn/Pb reflow temperature range are less critical, and that minor deviations in temperature of equipment and components generally do not create soldering problems.

What does Reflown mean?

to flow back
intransitive verb. 1 : to flow back : ebb. 2 : to flow in again. Other Words from reflow Example Sentences Learn More About reflow.

What is a KIC test?

KIC Testing The KIC test or KIC, or K1C, as it is also known, is used to determine the fracture toughness of metallic materials. The test consists of fracturing a specimen of a specified geometry that has had a sharp defect or fatigue precrack already introduced into it.

What can KIC thermal do for your oven?

KIC supplies the expertise with patented sensor hardware and software to monitor the product temperature profile during production. KIC offers you temperature data logging tools for setting up your oven or wave solder machine. You’re in control. Navigate to the best oven recipe to suit all your needs.

Which is the latest Thermal profiling software KIC?

Date: 28. Apr 2021 Description: The Profiling Software 2G is KIC’s latest software that is used with the SPS Smart Profiler, X 5 and K 2 profilers. This software is required for creating profiles that can be viewed with KIC’s new Mobile Profile Viewer App.

Why do we need industry excellence support from KIC?

Our multiple Industry Excellence Support awards testify to our focus. For manufacturers the purchase of machines and software is only a means to an end. KIC helps its customers utilize the technology properly to make sure that their investment in KIC products helps them achieve their goals.

How does the KIC 24 / 7 wave work?

The KIC 24/7 Wave uses this data to automatically calculate the preheat profile for every product manufactured. Additionally, the solder pot temperature and conveyor speed are all continuously monitored.